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LSCE-800 contact exposure machine

LSCE-800 contact exposure machine refers to that the mask plate directly contacts with the photoresist layer of the substrate, and the exposed figure has high resolution accuracy with the figure on the mask plate. The equipment is simple, and the line width can reach 800nm; A variety of models of positive and negative photoresist can be used together; It is suitable for ultraviolet or deep ultraviolet light exposure of materials ranging from special size substrates to very wide range of 4 sizes.

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Detailed parameters

Purpose: Contact exposure means that the mask plate directly contacts with the photoresist layer of the substrate. The exposed graphics and the graphics on the mask plate have high resolution accuracy and simple equipment;

1. Semiconductor manufacturing;

2. Optoelectronics and flat plates;

3. RF microwave, diffractive optics;

4. MEMS;

5. Concave convex or crystal clad equipment, etc.

Main specifications: line width can reach 800nm; A variety of models of positive and negative photoresist can be used together;
Applicable chip size: the sample size cannot be greater than 6 inches.
Product features:

1. The resolution is accurate;

2. Wider range of UV wavelength selection;

3. Support constant light intensity or constant power mode;

4. It is widely used in the fields of semiconductor, microelectronics, biological devices and nanotechnology.

Instrument detailed parameters：

Chip size	4 ", 6", 8 "
Exposure light source	365nm、380nm、395nm
Resolving power	3μm
Alignment accuracy	300nm
Scale Multiplier	1:0.5
Exposure mode	Contact exposure
Feature size uniformity	±10%
Size	170 cm130 cm180 cm

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