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LSMS-160 magnetron sputtering coater is a process test instrument used in the field of material science, which is used for various single-layer films, multilayer films and doped films. It can be plated with various hard films, metal films, alloys, compounds, semiconductors, ceramic films, dielectric composite films and other chemical reaction films, as well as ferromagnetic materials. It is mainly used for preparing metal electrodes and dielectric layers of organic photoelectric devices in the l
Application: Depositing thin films below several micrometers on the sample surface by sputtering, which can be used to prepare various metals, semiconductors, ferromagnetic materials, insulating oxides, ceramics and other materials.
Main specifications: 6 targets can be sputtered in sequence; Splashing of two targets at the same time; Splashing range is within 4 inches; Vacuum degree 8 × 10-8 torr, thickness uniformity error<± 5%, and sputtering number of microns or less.
Applicable chip size: sample size shall not be greater than 6 inches;
Splashable materials: metal like Al, Cu, Gr, Co, Fe, Ni, Pt, Ag, Ti, Ta; Alloy NiFe, CoFe, CoFeB, NiMn, FeMn, TbFeCo; Oxide MgO, etc.
Chip sample size | ≤6 inch |
Vacuum degree | 8 × 10-8 Toor |
Thickness uniformity error | <5% |
Sputtering thickness | 0-300nm |
Sputter material | Al、Cu、Gr、Co、Fe、Ni、Pt、Ag、TiO2、NiFe、NiMn... |
Size | 170cm*130*180cm |
Depositing thin films below several micrometers on the sample surface by sputtering can prepare various metals, semiconductors, ferromagnetic materials, insulating oxides, ceramics and other materials
溅镀膜厚测试